VIA Technologies EPIA-ML8000AG - VIA Motherboard - Mini ITX Manuel d'utilisateur télécharger pdf (Page 6)

SUMIT™ Connectors

SUMIT™ is an acronym for Stackable Uniﬁed Module Interconnect

Technology. It brings a stackable, I/O-centric, serial expansion approach

to system design that combines the strengths of yesterday’s general I/O

architectures with serial interconnect buses for future needs, including

PCI Express, USB, LPC, I

C, SPI, and ExpressCard interfaces.

Pico-ITXe is an open source standard designed in collaboration with

Small Form Factor Special Interest Group (SFF-SIG) and based on VIA’s

Pico-ITX form factor. With the same 10 cm x 7.2 cm dimensions as the

Pico-ITX, the Pico-ITXe speciﬁcation includes ﬁxed mounting holes and

SUMIT™ connectors that facilitate the development of stackable,

I/O-centric embedded devices with advanced serial bus technology.

Mounting holes

for SUMIT module

SUMIT

connector A

SUMIT

connector B

72.00

(Unit: mm)

100.00

Pico-ITXe Form Factor

60.00

72.00

VIA Pico-ITXe Embedded Board Form Factor

10 cm x 7.2 cm

Flexible I/O Options

The Pico-ITXe possesses the technical diversity to oﬀer system

developers considerable scope for customizing I/O simply and cost

eﬀectively through the addition of selected Pico-IO bus expansion

modules. When it comes to I/O layout, the Pico-ITXe form factor enables

ﬂexibility and stability, with using a customizable I/O expansion board in

a stackable, I/O-centric implementation.

Applications

The compact Pico-ITXe is ideally suited to demanding embedded

applications that require space saving and customized I/O options, such

as industrial automation, data acquisition and process monitoring, as

well as standalone platforms (e.g., mid-range signage and kiosk

solutions), and ruggedized systems.

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VIA Technologies EPIA-ML8000AG - VIA Motherboard - Mini ITX Manuel d'utilisateur Page 6